production operators

Job Description

- Prepare and set up the wire bond bond machine for the semiconductor packaging process
- Load substrates with dies already bonded into the machine
- Monitor the wire bonding process and ensure correct machine parameters
- Adjust machine settings (e.g., temperature, ultrasonic power, bonding speed) as needed
- Perform regular quality control checks on the wire bonded chips
- Identify and resolve issues during production
- Document production procedures, malfunctions, and quality findings

Job Requirements

Experience preferred
Flight expenses, Housing and Transport covered
Immediate Vacancy
Speak English
Able to read and write English
Able to station overseas for 3 months

Contact/ whatsapp : 90091844
Email : [email protected]

Work Location (MRT)