production operator

Job Description

Prepare and set up the DIE‑bond machine for the production process
- Load semiconductor chips and substrates into the machine
- Monitor the bonding process and ensure correct placement of chips
- Adjust machine settings (e.g., temperature, pressure, positioning) as needed
- Perform regular quality control checks on the bonded chips
- Identify and resolve issues during production
- Document production procedures, malfunctions, and quality findings

Job Requirements

Experience preferred
Flight expenses, Housing and Transport covered
Immediate Vacancy
Speak English
Able to read and write English
Able to station overseas for 3 months
Contact/ whatsapp : 90091844
Email : [email protected]

Work Location (MRT)